Siemens EDA (Siemens Digital Industries Software)

3DIC Packaging SI/PI Applications Engineer

FREMONT, CAPosted 30+ days ago

Job summary

  • Job post source

    This job is directly from Siemens EDA (Siemens Digital Industries Software)

  • Job overview

    The 3DIC Packaging SI/PI Applications Engineer at Siemens EDA plays a crucial role in addressing customer challenges in advanced packaging, leveraging Siemens' technologies to drive innovation in 2.5D/3D IC packaging.

  • Responsibilities and impact

    The engineer will manage technical engagements with customers, collaborate with sales to define strategies, provide solutions to customer problems, and communicate feedback to R&D teams.

  • Compensation and benefits

    The total cash compensation ranges from $142,800 to $285,600, including a 20% annual incentive target, along with various health and wellness benefits, paid time off, and flexible vacation options.

  • Experience and skills

    Candidates should have a BS degree, experience in Signal Integrity/Power Integrity/Electromagnetics, Python/VBScript skills, and excellent communication abilities, with 2+ years in relevant fields preferred.

  • Career development

    Opportunities for professional growth include collaboration with R&D teams and leadership roles in guiding other Application Engineers.

  • Work environment and culture

    Siemens promotes flexibility in work arrangements, values diversity, and encourages creativity and curiosity among its employees.

  • Company information

    Siemens EDA is part of Siemens Digital Industries Software, focusing on industrial software solutions and dedicated to equality and diversity in the workplace.

  • Team overview

    The specific team dynamics and size are not detailed in the description, but collaboration with a broader AE organization is emphasized.

  • Job location and travel

    The job allows for flexibility between working at home and the office, with approximately 30% business travel required.

  • Application process

    Details on the application process are not provided in the description, but candidates are encouraged to apply based on qualifications and merit.

  • Unique job features

    The role offers unique opportunities to influence product direction and engage with cutting-edge technology in the 2.5D/3D IC packaging space.

Company overview

Siemens EDA, part of Siemens Digital Industries Software, specializes in electronic design automation (EDA) tools and software that enable the design and development of complex electronic systems and integrated circuits. They generate revenue through the sale of software licenses, maintenance services, and consulting. The company has a rich history, evolving from the acquisition of Mentor Graphics in 2017, which significantly bolstered Siemens' capabilities in the EDA sector. This strategic move has positioned Siemens EDA as a key player in the semiconductor and electronics industries, providing innovative solutions that drive digital transformation.

How to land this job

  • Tailor your resume to showcase your expertise in Signal Integrity, Power Integrity, and Electromagnetics, emphasizing any relevant experience in 2.5D/3D IC packaging technologies.

  • Highlight your proficiency in Python and VBScript automation, as these skills are crucial for developing automated solutions around Siemens EDA's product line.

  • Emphasize your strong communication skills and professional customer presence, as these are essential for driving technical engagements with a diverse customer base.

  • Apply through multiple platforms, such as Siemens' corporate site and LinkedIn, to maximize your chances of being noticed for this role.

  • Connect with professionals in the relevant division at Siemens EDA on LinkedIn, and consider ice breakers like discussing recent trends in 3D IC packaging or asking for insights on their customer engagement strategies.

  • Optimize your resume for ATS by incorporating specific keywords from the job description, such as 'Signal Integrity,' 'Power Integrity,' 'EM analysis,' and '2.5D/3D IC packaging.'

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