Job summary
Company overview
Ouster is a leading provider of high-resolution digital lidar sensors used in various industries, including automotive, industrial automation, smart infrastructure, and robotics. They generate revenue by selling their advanced lidar technology, which enhances the capabilities of autonomous vehicles, industrial machinery, and smart city applications. Founded in 2015, Ouster has rapidly grown due to its innovative approach to lidar technology, leveraging digital architecture to deliver superior performance and reliability. Key milestones include their public listing via a SPAC merger in 2021, which has bolstered their financial position and market presence.
How to land this job
Position your resume to showcase your experience in semiconductor packaging and process development, emphasizing your familiarity with multi-layer ceramic and CMOS image sensor packages.
Highlight your skills in designing microelectronic assembly processes and your experience with wafer-level processing, as these are critical for the role at Ouster.
Apply for the Silicon Photonics Packaging Engineer position through multiple platforms, including Ouster's corporate site and LinkedIn, to maximize your exposure to hiring managers.
Connect with professionals in the engineering division at Ouster on LinkedIn to gain insights about the company culture and the specific requirements for the role; consider ice breakers like discussing recent advancements in LIDAR technology or asking about their experiences at Ouster.
Ensure your resume is optimized for ATS by incorporating relevant keywords from the job description, such as 'microelectronic assembly', 'wafer inspection', and 'failure analysis', to enhance your chances of passing initial screenings.
Utilizing Jennie Johnson's Power Apply feature can streamline your application process by tailoring your resume, identifying the best job application channels, and helping you connect with potential contacts at Ouster, so you can focus your energy on preparing for interviews.
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