Senior Foundry Applications Engineer (Packaging Design)
PHOENIX, AZPosted 24 days ago
Job summary
Job post source
This job is directly from Intel Corporation
Job overview
The Senior Foundry Applications Engineer (Packaging Design) at Intel supports advanced packaging technologies and customer success within Intel Foundry Services, focusing on design tools and methodologies for high-performance applications.
Responsibilities and impact
The engineer will work closely with customers to define, develop, and implement design tools, flows, and methodologies, serve as a technical expert on packaging design tools, and consult on design and implementation issues to ensure customer product success.
Compensation and benefits
The position offers a competitive total compensation package including an annual salary range of $177,200 to $250,160, stock, bonuses, health benefits, retirement plans, and vacation.
Experience and skills
Candidates must have a Bachelor's degree in Electrical/Computer Engineering or STEM, 8+ years of package design experience with relevant EDA tools, customer interfacing skills, and US citizenship with ability to obtain security clearance; preferred qualifications include advanced degrees, active security clearance, and experience with specific EDA tools and scripting languages.
Work environment and culture
Intel Foundry Services emphasizes customer success, technological innovation, and collaboration within a diverse and inclusive environment with a focus on service and capacity commitments.
Company information
Intel Corporation is a leading semiconductor company advancing silicon process and packaging technology for AI and other high-performance systems, with a strong commitment to supply chain resilience and customer-focused foundry services.
Team overview
The role is within the ASE team in the Intel Foundry ADG organization, supporting aerospace, defense, and government customers with advanced packaging technology solutions.
Job location and travel
The position is based in Phoenix, Arizona, USA, requiring on-site presence with shift 1 hours.
Unique job features
This role is distinguished by its focus on cutting-edge packaging design tools and methodologies within a major semiconductor foundry service, requiring security clearance and direct customer engagement.
Company overview
Intel Corporation is a global technology company renowned for designing and manufacturing advanced semiconductor products, including microprocessors, chipsets, and integrated circuits, which power a vast array of computing devices. The company generates revenue primarily through the sale of these semiconductor products to computer manufacturers, data centers, and other technology firms. Founded in 1968 by Robert Noyce and Gordon Moore, Intel has been at the forefront of innovation in the tech industry, playing a pivotal role in the development of the personal computer and maintaining a significant influence in the evolution of modern computing technologies.
How to land this job
Position your resume to highlight extensive experience in package design and proficiency with EDA tools such as Cadence, Synopsys, and Siemens Xpedition, emphasizing your ability to support advanced packaging technologies and system co-design.
Focus on demonstrating your skills in customer interfacing, analyzing design issues, and defining functional specifications for EDA vendors, showcasing your technical credibility and problem-solving capabilities.
Apply through multiple channels including Intel Corporation's official careers site and LinkedIn to maximize your application visibility and ensure it reaches the right recruiters.
Connect with engineers and managers within Intel Foundry ADG on LinkedIn; use ice breakers like commenting on Intel's IDM 2.0 vision or recent packaging technology advancements to start meaningful conversations.
Optimize your resume for ATS by incorporating keywords from the job description such as 'package design,' 'EDA tools,' 'system co-design,' 'design verification,' 'customer interfacing,' and scripting languages like 'Python' and 'Tcl' to pass automated screenings.
Utilize Jennie Johnson's Power Apply feature to automate tailored resume submissions, identify optimal application platforms, and discover LinkedIn contacts for networking, allowing you to focus more on interview preparation and skill enhancement.
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