Job summary
Job post source
This job is from a recruiting firm hiring for a separate company.
Job overview
The IC Package Design Engineer role involves designing complex flip-chip-BGA packages for high-performance ASICs used in AI, networking, HPC, and 5G applications, contributing to advanced package structures and design efficiency.
Responsibilities and impact
The engineer is responsible for ASIC package design and layout focusing on signal and power integrity, manufacturability, reliability, and thermal aspects, managing multiple projects, interfacing with customers, and improving design group efficiency.
Experience and skills
Requires a BSEE with 8+ years or MSEE with 6+ years in flip-chip-BGA package design including high-speed SerDes, knowledge of signal and power integrity, and experience with Cadence APD or equivalent tools; strong self-management and teamwork skills are needed.
Job location and travel
The job can be located in San Jose, CA or Fort Collins, CO.
Company overview
Advanced Technology Search is a specialized recruitment firm focusing on the placement of professionals in the high-tech and semiconductor industries. They generate revenue through client fees for successful candidate placements, often working with leading companies in technology sectors to fill critical roles. Founded in 1987, the company has built a reputation for its deep industry knowledge and extensive network, making it a trusted partner for both job seekers and employers in niche markets.
How to land this job
Tailor your resume to highlight extensive experience in flip-chip-BGA package design, emphasizing high-speed SerDes and power delivery expertise, as these are central to the role at Advanced Technology Search.
Showcase proficiency with Cadence APD or equivalent package layout CAD tools, along with your understanding of signal integrity, power integrity, manufacturability, reliability, and thermal considerations in ASIC package designs.
Apply through multiple channels including Advanced Technology Search's corporate careers site, LinkedIn, and other job boards where the position is posted to maximize your visibility.
Connect with engineers and team members in the R&D or package engineering divisions at Advanced Technology Search on LinkedIn; use ice breakers like commenting on their recent projects involving AI or 5G technologies, or asking about collaboration across time zones to start meaningful conversations.
Optimize your resume for ATS by incorporating keywords from the job description such as 'flip-chip-BGA package design,' 'high-speed SerDes,' 'Cadence APD,' 'signal integrity,' and 'power integrity' to ensure it passes automated screenings.
Leverage Jennie Johnson's Power Apply feature to automate applying through multiple channels, tailor your resume with the right keywords, and identify LinkedIn contacts for networking, allowing you to focus your energy on preparing for interviews and improving your skills.
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